Job title: SENIOR ENGINEER, PDE PDS/DT
Company: Micron
Job description: Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR25912 SENIOR ENGINEER, PDE PDS/DT Responsibilities Partner with process engineering teams to understand the packaging process and develop analysis models. Guide test vehicle development to improve simulation correlation to empirical data. Develop test plan wherever necessary to verify the simulation models and validate analysis approach in correlation with test outcomes. Participates in development of simulation modeling methodologies in Structural and Multiphysics domain Provide process & equipment simulation reports to support pathfinding efforts, technology development, and product introduction Deploys developed simulation methodologies to strengthen ‘Analysis First’ strategy and develop Digital Twins. Communicate FEA analysis results to process engineers and provide technical and/or design recommendations. Responsible for mentoring and maturing analysis capability of structural and thermo-structural domain Requirements A strong background in Solid Mechanics with emphasis on both analytical and measurement methods. Solid knowledge through experience in FEA and hand calculations with established numerical techniques or through the development of novel analysis techniques. Experience in static/ dynamic/ thermal analysis and multi-physics modeling with ability to handle convergence issues due to large deformations, large strains, plasticity, creep, viscoplasticity, viscoelasticty and contact. Detailed knowledge of material properties, material property test methods, fatigue life, creep damage assessment and measurements of IC packaging and related areas Must be proficient in using Ansys Mechanical, APDL, ACT, DesignModeler and Spaceclaim Experience in defining and implementing numerical and /or lab experiments for feasibility and validation of concepts and solutions to support new package technology development. A good understanding of semiconductor packaging processes, materials and technology trends such as Dicing, Backgrinding, Die attach, organic substrate properties, over molding materials and properties, wire-bonding materials and methods, C4 or Cu Pillar attachment methods, etc. Ability to work in a team environment and get along with other specialists Strong oral and written communication skills. Degree required: MS/M.Tech with 5 Years or PhD with 0 to 2 years’ experience Mechanical Engineering, Materials Engineering, Physics, or related discipline About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities – from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Please note that in order to assist in providing a safe and healthy workplace for all Micron team members, new employment offers for jobs based in India, Malaysia, Singapore, and the U.S., are contingent upon the applicant’s provision of a copy of their COVID-19 vaccination document to Micron on a confidential basis prior to their scheduled start date confirming that they have completed the COVID-19 vaccination process, subject to any written request for medical or religious accommodation and to the extent permitted by applicable law. To request assistance with the application process and/or for reasonable accommodations,please contact Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Expected salary:
Location: Hyderabad, Telangana – Secunderabad, Telangana
Job date: Fri, 13 May 2022 22:23:44 GMT
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