Job title: Package Integration Engineer
Company: Micron
Job description: Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR28608 Package Integration Engineer As a Package integration Engineer to lead vertical integration between package and Si process at Micron Technology, Inc., you will work in the Advanced Package Technology Development team. In this position, you will lead a test vehicle design and vertical integration and finding efficient structures and materials to build an innovative package. Scope of your work is to address all test vehicle designs, process flow and structures aspects of packaging technology that is associated with design and structure interactions along with process and assembly integration. At the same time, you will also have responsibility for performing predictive and regression analysis. Finally, through the whole integration activity, it is your role to build all test vehicles and proposing desired process flow that are needed for the developments of the future package in advance. This position will collaborate with package architecture, device/process integration and design teams. Perform test key design and deliver test vehicle reticle to support package development. Build high level test vehicle specification to enable new package evaluation. Analyze fail mode of developing package with strong design and device integration background Provide structure, layout and assembly/fab process recommendations for successful package development Propose possible cause and suspected mechanism for fail analysis. New architecture and layout recommendation using various results and knowledge. Solve complicate problem using high level of integration ability, methodical and logical approach with accuracy and attention details Manage numerous projects and efficiently influence and communicate with related teams. Analyze, model and interpret data for package development Provide proposed architecture and structure reports to internal customers and guide innovation for fab and package development. Successful candidates must have: Excellent knowledge in device structure and design rules, device integration. Well knowledge in layout structure and circuit description. Hands on experience of major layout tools (CADENCE and/or similar layout software) Experienced integrator of fab process, PWF, assembly. Understanding of fab/package assembly process and fail analysis techniques and/or approach to improve product quality and process efficiency Deep understanding of packaging/device structures, processes and reliability Validated knowledge through Si device and wafer/package test. Detailed knowledge of fail analysis methodology and electrical test methods A good understanding of semiconductor packaging/semiconductor device technology and trends such as 2.5D and 3D Effective oral and written communication skills Ability to work in a team environment and collaborate with other specialists to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package development Proactive and creative approach for problem solving Degree required: MS or PhD preferred Academic Discipline(s): Mechanical Engineering, Physical Engineering, Materials Engineering or related field All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Please note that in order to assist in providing a safe and healthy workplace for all Micron team members, new employment offers for jobs based in India, Malaysia, Singapore, and the U.S., are contingent upon the applicant’s provision of a copy of their COVID-19 vaccination document to Micron on a confidential basis prior to their scheduled start date confirming that they have completed the COVID-19 vaccination process, subject to any written request for medical or religious accommodation and to the extent permitted by applicable law. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Expected salary:
Location: Hyderabad, Telangana – Secunderabad, Telangana
Job date: Thu, 16 Jun 2022 22:48:50 GMT
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