Job title: ASSOCIATE ENGINEER, PDE PDS/DT
Company: Micron
Job description: Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR21697 ASSOCIATE ENGINEER, PDE PDS/DT Responsibilities Partner with process engineering teams to understand the packaging process and develop analysis models. Structural analysis using Finite Element Methods or hand calculations of the various process involved in semiconductor packaging for predicting and enhancing the performance Guide test vehicle development to improve simulation correlation to empirical data. Develop test plan wherever necessary to verify the simulation models and validate analysis approach in correlation with test outcomes. Participates in development of simulation modeling methodologies in Structural, Thermal, Thermo-Structural and Multiphysics domain Provide process & equipment simulation reports to support pathfinding efforts, technology development and product introduction Deploys developed simulation methodologies to strengthen ‘Analysis First’ strategy and develop Digital Twins. Communicate FEA analysis results to process engineers and provide technical and/or design recommendations. Requirements Solid knowledge through coursework, or experience in solid mechanics, structural dynamics, finite element methods. Ability to draw free body diagrams and perform hand calculations. Working knowledge through experience or coursework in FEA and high-fidelity Multiphysics simulations Knowledge of material properties and material property test methods. Experience or knowledge through coursework on modeling non linearities and resolve convergence issues will be plus Knowledge of one or more software’s like Ansys, Abaqus, COMSOL and Simcenter Knowledge on semiconductor packaging processes and materials is a plus Strong oral and written communication skills. Ability to work in a team environment and get along with other specialists to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development. Degree required: MS/MTech with 0 to 3 years or PhD with 0- 2 years Mechanical Engineering, Applied Mechanics, Aerospace Engineering, Materials Engineering, Physics, or related discipline All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Please note that in order to assist in providing a safe and healthy workplace for all Micron team members, new employment offers for jobs based in India, Malaysia, Singapore, and the U.S., are contingent upon the applicant’s provision of a copy of their COVID-19 vaccination document to Micron on a confidential basis prior to their scheduled start date confirming that they have completed the COVID-19 vaccination process, subject to any written request for medical or religious accommodation and to the extent permitted by applicable law. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Expected salary:
Location: Hyderabad, Telangana – Secunderabad, Telangana
Job date: Mon, 30 May 2022 22:07:16 GMT
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